Soloplan will be exhibiting at bonding in Dresden on Tuesday, 18.04.2023. We cordially invite you to visit us at booth F6. The event will take place from 9:30 am to 4:30 pm at the TU Dresden. Visitors will have the opportunity to find out about a wide range of job profiles and talk to potential employers in person.
This is the 18th time that Soloplan has been part of the Dresden Company Contact Fair at the Technical University. Our team will be available for numerous discussions and will answer all kinds of questions about career opportunities at Soloplan. On 18.04.2023, you can get a first-class insight into our wide range of offers, from internships to working student activities and theses to career entry.
As an IT service provider in the logistics sector, we offer students from the fields of computer science, transport sciences and business administration exciting activities in an internationally oriented family business.
We look forward to good conversations!
You don’t have time this year? No problem! Find out more about your career opportunities at Soloplan here.